| 技术内容 |
- 该公司磁控(性)溅射镀膜技术(Maghetron Sputtering Vacuum Coating Techndogy)可喷镀(Coating)之导电物包括钛、铬、钢、铜、金、银、不锈钢等，非导电物质为二氧化矽、氧化物、ITO(铟锡氧化物)等。
- 该技术(VPT-1000-M型)可覆盖物(Coating)之尺寸为2.3×1.6 m，且覆盖物(Coating)之材料可为ITO(锡锡氧化物)。
- VPT-200型之磁控(性)溅射镀膜技术，可覆盖到之材料(Substate)上有金属、玻璃、陶瓷、塑胶、各种其他材料等。
- VPT-200型可喷镀之厚度从0.001μm至10μm间。
- 价格便宜，约为美金20万元，(为日本、德国1/ 5价格)交货期6个月。
- VPT-200型之磁控(性)溅射镀膜技术之基本资料如下：
No. MAIN PARAMETERS DATA VPT 200
1. Chamber,Dimensions, mml Diameterl HeightWater cooled 12501500
2. Maximum dimensions of products (zone to be coat), mm 900×1250
3. Pumping-Systeml Pump down time up to 3o10-3 Pa (clean vacuum chamber), min 25
5. Sources for deposition-Planar magnetronl Numberl Dimensions of Ti-target, mmEngrgy supply unitsl Numberl parameters 41300×130×104600V, 30A
6. Device for ion clea ning-linear ion-beam sourcel Typel Numberl Discharge current, mA x cm -1l Accelerate voltage, V Cold2103000
7. Bias Power supply for substrates 50-300V, 20A
8. Typical duration of the coating cycle, min 60
9. Water supply systems (hot and cold)l Flow rate (cold), m3 /hl Pressure, bar 4,02-4
10. Electric powerl Connected load, kVAl Voltage, frequency 100380V, 50Hz
11. Rotary spindle centred in the bottom of the chamber：l Load-axial, kg (max)l Number of variants of rotary of substrates 110 3
12. Gas admission systeml Number of variants of rotary of substrates 3
13. Temperature control, ℃l interval 100-350
14. Control system Automatic
15. Dimensions (max)l Floor area required, m2 20
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